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Detailed trademark information from the China mainland trademark database
Chinese word mark 京芯
English word mark
2018-05-29
2019-09-20
2019-12-21
2029-12-20

Registration number 31250257 Trademark 京芯
Class class 9 Register affiche issue 1676
Application Date 2018-05-29 First trial affiche 1664
Register date 2019-12-21 Renew date
Trademark types General Trademark
Goods and Services
基因芯片（DNA芯片）;生物芯片;集成电路;芯片（集成电路）;电子芯片
유전자 칩 (유전자 칩) , 유전자 칩 , 집적 회로 , 칩 (집적 회로) , 전자, 반도체 ,
Trademark possessor
北京康普森生物技术有限公司
bei jing kang pu sen sheng wu ji shu you xian gong si
Address
北京市昌平区回龙观镇生命园路4号院4号楼7层701
bei jing shi chang ping qu hui long guan zhen sheng ming yuan lu 4 hao yuan 4 hao lou 7 ceng 7 0 1
Trademark
Protection Term		 2019-12-21 to 2029-12-20 Appoint Time
Date of International
Registration		 Priority Date
Color Joint Trademark not
Agency name 北京聿华联合知识产权代理有限公司
Picture
Logo
Similar Group
0910;0913
Trademark gazette
2019-09-20 No.1664 Trademark preliminary examination gazette page 921 Look
2019-12-20 No.1676 Trademark registration gazette I page 165871 Look
Status




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